Method of manufacturing light emitting device

ABSTRACT

A method of manufacturing a light emitting device includes: bonding a wavelength conversion member on an upper face of a light emitting element while disposing a first light guide member to extend from a lateral face of the light emitting element to a lower face of the wavelength conversion member, the lower face of the wavelength conversion member having a larger area than the upper face of the light emitting element; and bonding a light transmissive member on an upper face of the wavelength conversion member while disposing a second light guide member to extend from the upper face of the wavelength conversion member to a lateral face of the light transmissive member, a lower face of the light transmissive member having a smaller area than the upper face of the wavelength conversion member.

CROSS-REFERENCE TO RELATED APPLICATION

This application is a continuation application of U.S. patentapplication Ser. No. 16/053,183 filed on Aug. 2, 2018. This applicationclaims priority to Japanese Patent Application No. 2017-159127, filed onAug. 22, 2017. The entire disclosures of U.S. patent application Ser.No. 16/053,183 and Japanese Patent Application No. 2017-159127 arehereby incorporated by reference in their entireties.

BACKGROUND

The present disclosure relates to a method of manufacturing a lightemitting device.

In the past, a light emitting device has been proposed having a smallemission area by disposing a light guide member, which has a smallerlight emission face than the area of the light emission face of a lightemitting element, on the upper face of the light emitting element. See,for example, Japanese Unexamined Patent Application Publication No.2013-110199 and International Publication WO Publication No.2010/044240.

SUMMARY

In the light emitting devices disclosed in the patent publicationsdescribed above, however, the emission area decreases while the lightemitted from the light emitting element passes through the wavelengthconversion member. This allows for repeated scattering of the light inthe wavelength conversion member before reaching the emission face ofthe light emitting device, which likely results in reduced lightextraction efficiency.

The present disclosure is made in view of the problems discussed aboveand aims to provide a manufacturing method for a light emitting devicehaving improved light extraction efficiency.

According to one aspect of the present disclosure, a method ofmanufacturing a light emitting device includes: bonding a wavelengthconversion member on an upper face of a light emitting element whiledisposing a first light guide member to extend from a lateral face ofthe light emitting element to a lower face of the wavelength conversionmember, the lower face of the wavelength conversion member having alarger area than the upper face of the light emitting element; andbonding a light transmissive member on an upper face of the wavelengthconversion member while disposing a second light guide member to extendfrom the upper face of the wavelength conversion member to a lateralface of the light transmissive member, a lower face of the lighttransmissive member having a smaller area than the upper face of thewavelength conversion member.

The light emitting device manufactured according to an embodiment of thepresent disclosure can realize improvement of its light extractionefficiency.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1A is a sectional view schematically illustrating the constructionof the light emitting device according to one embodiment of the presentdisclosure.

FIG. 1B is a plan view schematically illustrating the construction ofthe light emitting device according to the embodiment of the presentdisclosure.

FIG. 1C is an enlarged view of the pertinent portion of FIG. 1B.

FIG. 2 is a sectional view schematically illustrating the constructionof the light emitting device according to another embodiment of thepresent disclosure.

FIGS. 3A to 3E are simplified diagrams showing structures of the lightemitting device according to the embodiment and the light emittingdevices according to comparison examples.

DETAILED DESCRIPTION

Examples of the light emitting devices according to certain embodimentsof the present disclosure will be explained below with reference to thedrawings. The drawings being referred to in the explanations below areschematic illustrations of the present disclosure. As such, the relativesizes of, and spacing and positional relationships between, theconstituent members might be exaggerated, or some members might beomitted. In the explanations below, moreover, the same designations andreference numerals, as a rule, denote the same members or those ofsimilar type, for which detailed explanations will be omitted whenappropriate.

Light Emitting Device

The light emitting device 10 according to one embodiment, as shown inFIG. 1, includes: a light emitting element 11; a wavelength conversionmember 12 disposed on an upper face 11A of the light emitting element 11and having a lower face 12B that has a larger area than the upper face11A of the light emitting element 11; a first light guide member 13extending from lateral faces of the light emitting element 11 to thelower face of the wavelength conversion member 12; a light transmissivemember 14 disposed on an upper face 12A of the wavelength conversionmember 12 and having a lower face 14B that has a smaller area than theupper face 12A of the wavelength conversion member 12; and a secondlight guide member 15 extending from the upper face 12A of thewavelength conversion member 12 to lateral faces of the lighttransmissive member 14. The upper face 14A of the light transmissivemember 14 is exposed from other constituent members of the lightemitting device 10, and serves as the principal light extraction face ofthe light emitting device 10. Such a light emitting device 10 can beutilized as a light source, for example, for lighting fixtures,automotive lighting systems, and the like.

In this light emitting device 10, the first light guide member 13 isdisposed to extend from the outer edges of the light emitting element 11to the outer edge of the lower face of the wavelength conversion memberwhich extends out from the light emitting element 11 in a plan view.This allows the light emitted from the light emitting element 11 toenter the lower face 12B of the wavelength conversion member 12 whilethe area of the light emitting face becomes larger. Furthermore, thesecond light guide member 15 is disposed to extend from the outer edgesof the light transmissive member 14 to the outer edge of the upper faceof the wavelength conversion member 12 which extends out from the lighttransmissive member 14 in a plan view. This allows the output light fromthe upper face of the wavelength conversion member 12 to be externallyreleased while the area of the light emission face becomes smaller.

In such a light emitting device, wavelength of the light emitted fromthe light emitting element can be efficiently converted, allowing thearea of the light extraction face for the light after wavelengthconversion to be set smaller, thereby enabling efficient extraction ofhigh luminance light.

Light Emitting Element 11

For the light emitting element 11, it is preferable to employ a lightemitting diode having semiconductor layers, including an n-typesemiconductor layer, a p-type semiconductor layer, and a light emissionlayer. One having an appropriate wavelength can be selected depending onthe purpose and applications. The light emitting element 11 has an upperface 11A on one side of the semiconductor stack. Examples of the lightemitting elements 11 which emit blue light having a wavelength of from430 nm to 490 nm, or green light having a wavelength of from 490 nm to570 nm include those employing semiconductor layers, such as ZnSe,nitride-based semiconductors (In_(X)Al_(Y)Ga_(1-X-Y)N, 0≤X, 0≤Y, X+Y≤1),GaP and the like. For the light emitting elements 11 which emit lighthaving a wavelength of from 620 nm to 750 nm, those employing GaAIAs,AlInGaP, and the like can be used. Among these examples, a nitridesemiconductor (In_(X)Al_(Y)Ga_(1-X-Y)N, 0≤X, 0≤Y, X+Y≤1) is preferablyused because it can emit short wavelength light and efficiently activatewavelength conversion substances such as phosphors contained in thewavelength conversion member. The composition, emission color, size, andthe like of the light emitting element 11 can be suitably selected inaccordance with the purpose and applications.

The light emitting element 11 includes a pair of electrodes connected tothe semiconductor layers. The pair of electrodes may respectively bearranged on one face and the other faces of the semiconductor stack, butis preferably both disposed on the same side of the semiconductor stack.This allows the light emitting element 11 to be flip-chip mounted on asubstrate 17. When flip-chip mounting the light emitting element on thesubstrate 17 using the face having the pair of electrodes as the lowerface, the upper face 11A opposite the lower face will serve as theprincipal light extraction face of the light emitting element.

The light emitting element 11 can have various planar shapes, includinga circular, ellipsoidal, or a polygonal shape such as a square, hexagon,but preferably has a square, rectangular, or hexagonal shape. The sizecan be suitably set depending on the applications and the performance tobe achieved.

On the upper face 11A of the light emitting element 11, as describedlater, a wavelength conversion member 12 is disposed. The wavelengthconversion member 12 can be secured on the upper face 11A of the lightemitting element 11 by using, for example, a light transmissiveadhesive. The wavelength conversion member 12 and the light emittingelement 11 may be directly bonded without interposing an adhesive or thelike.

A single light emitting device may include a single light emittingelement, or as shown in FIG. 2, two or more elements.

Wavelength Conversion Member 12

The wavelength conversion member 12 is disposed on the upper face 11A ofthe light emitting element 11. The wavelength conversion member 12 canbe disposed and secured onto the upper face of the light emittingelement 11 by employing various bonding methods. As described earlier,the wavelength conversion member 12 may be secured to the upper face 11Aof the light emitting element 11 by interposing an adhesive or the like,or without interposing an adhesive. When directly bonded without anadhesive, the light emitted from the light emitting element can enterthe wavelength conversion member 12 without any interference by anadhesive or the like to thereby improve the light extraction efficiency.

Examples of adhesives include materials similar to the lighttransmissive resins used to construct the first and second light guidemembers discussed later.

The lower face 12B of the wavelength conversion member 12 has a largerarea than the upper face 11A of the light emitting element 11. The lowerface 12B of the wavelength conversion member 12, for example, can havean area which is at least 10% larger than the upper face 11A of thelight emitting element 11.

The planar shape of the wavelength conversion member 12 can be acircular, ellipsoidal, or a polygonal shape such as a square, hexagon,or the like. The shape is preferably a square, rectangle, or regularhexagon among such examples, more preferably the same planar shape asthat of the light emitting element 11.

The wavelength conversion member 12 is preferably disposed so that theupper face 11A of the light emitting element 11 is contained within thelower face 12B. For example, in a plan view, some or all of the outeredges of the lower face 12B of the wavelength conversion member 12 arepositioned on the outside of the outer edges of the upper face 11A ofthe light emitting element 11. In other words, the light emittingelement 11 is preferably disposed so that its outer edges are on theinside of the outer edges of the lower face 12B of the wavelengthconversion member 12 in a plan view. This allows the light emitted fromthe light emitting element 11 to efficiently enter the wavelengthconversion member 12. Furthermore, the lower face 12B is preferablydisposed so that the center thereof substantially coincides with thecenter of the upper face 11A of the light emitting element 11.

The wavelength conversion member 12 has a lower face 12B, an upper face12A opposing the lower face 12B, and lateral faces contiguous to thelower face 12B and the upper face 12A. The upper face 12A and the lowerface 12B are substantially equal in size, and are substantially inparallel with one another. Moreover, the lateral faces between the upperface 12A and the lower face 12B are preferably substantiallyperpendicular to the upper face 12A and the lower face 12B. This canmore effectively mitigate the first light guide member 13 and/or thesecond light guide member 15 described later from wetting and spreadingonto the lateral faces.

The wavelength conversion member 12 includes a phosphor that can convertat least some of the wavelengths of the light emitted from the lightemitting element 11 into light having a different wavelength. For thewavelength conversion member 12, for example, a sintered body of aphosphor or a sheet of a resin, glass, or ceramic material containing aphosphor is preferably used. Examples of phosphors includecerium-activated yttrium aluminum garnet-based phosphors (YAG:Ce);cerium-activated lutetium aluminum garnet-based phosphors (LAG:Ce);europium- and/or chromium-activated nitrogen-containing calciumaluminosilicate-based phosphors (CaO—Al₂O₃—SiO₂:Eu); europium-activatedsilicate-based phosphors (for example, (Sr,Ba)₂SiO₄:Eu); nitride-basedphosphors, such as ß-SiAlON phosphors (for example,Si_(6-z)Al_(z)O_(z)N_(8-z):Eu (0<Z<4.2)), CASN-based phosphors andSCASN-based phosphors; KSF-based phosphors (K₂SiFe₆:Mn), sulfide-basedphosphors, and quantum dot phosphors. By combining and/or employingthese phosphors using an appropriate blending ratio for a given color,the color rendering properties and/or color reproducibility can beadjusted.

YAG-based phosphors represent those that allow for emission ofwhite-based mixed color light when suitably combined with a blue lightemitting element.

In the case of producing a white light emitting device, the types andconcentrations of the phosphors contained in the wavelength conversionmember 12 can be suitably set so that it can emit white light. In thecase of producing a white light emitting device, the concentration ofthe phosphors contained in the wavelength conversion member 12, forexample, can be 5 to 50%.

A red light emitting device can be produced by using a blue lightemitting element as the light emitting element 11 and a nitride-basedsemiconductor having a large red component as the phosphor. Moreover,amber light can be output by employing a blue light emitting element asthe light emitting element 11 and a YAG-based phosphor and anitride-based phosphor having large red components as the phosphors. Theamber color refers to the chromaticity range corresponding to the regioncomposed of the longer wavelength region of yellow and the shorterwavelength region of yellow-red as specified in JIS Z8110, or the regionbetween the yellow region and the shorter wavelength region ofyellow-red of the safety colors as specified in JIS Z9101. This is aregion having the dominant wavelength falling in the range of, forexample, from 580 nm to 600 nm. In the case of producing a red or amberlight emitting device, the concentration of the phosphors contained inthe wavelength conversion member is, for example, about from 60 to 80mass percent.

The wavelength conversion member 12 may be formed with a single layer ofone type of material, a single layer of two or more types of materialscombined, or by stacking two or more single layers.

The wavelength conversion member 12, moreover, may also contain a lightdiffusing material as needed. Examples of light diffusing materialsinclude titanium oxide, barium titanate, aluminum oxide, silicon oxide,and the like.

From the standpoint of heat dissipation and light extraction efficiency,the smaller the thickness T of the wavelength conversion member 12 is,the more preferable it is. Furthermore, the wavelength conversion member12 preferably has the thickness T that can impart a sufficientmechanical strength to the wavelength member 12 without allowing themechanical strength to degrade during the manufacturing process. Takingthese into consideration, the thickness, for example, can be 20 μm to300 μm, preferably 50 μm to 200 μm, more preferably 50 μm to 150 μm. Aslong as it contains wavelength conversion substances required to achievea given emission color, the thinner the wavelength conversion member 12,the better it is from the standpoint of heat dissipation and lightextraction efficacy, but is formed to a thickness in the above ranges onaccount of machining accuracy during the production of the wavelengthconversion member.

The thickness T of the wavelength conversion member 12 is preferablysmaller than the thickness of the light transmissive member describedlater. This can reduce the light leakage from the part of the upper faceof the wavelength conversion member 12 not covered by the lighttransmissive member to travel via the cover member described latertowards the light emission face, thereby producing a light emittingdevice having a clear distinction between the emission part andnon-emission part.

A single light emitting device may include one wavelength conversionmember, or multiple wavelength conversion members. When a light emittingdevice includes multiple light emitting elements, as shown in FIG. 2, asingle wavelength conversion member may be provided for the multiplelight emitting elements, or each light emitting element may beindividually provided with a wavelength conversion member.

When a single wavelength conversion member is provided for multiplelight emitting elements, the area and the positions of the outer edgesdescribed earlier, as well as the distances W2, W3, and W1 describedlater, can be set to those that correspond to the area enclosing theouter edges of the multiple light emitting elements, the positions ofthe edges enclosing all outer edges of the light emitting elements, andthe distances corresponding thereto.

First Light Guide Member 13

The first light guide member 13 is disposed to extend from the lateralfaces of the light emitting element 11 to the lower face 12B of thewavelength conversion member 12. The first light guide member 13 coversat least parts of the lateral faces of the light emitting element 11.The first light guide member 13 may cover the lateral faces of the lightemitting element 11 entirely in the height direction. That is, thelowermost edges of the first light guide member 13 may coincide with thelowermost edges of the lateral faces of the light emitting element 11.This allows the emitted light from the lateral faces of the lightemitting element 11 to be reflected at the interfaces between the firstlight guide member 13 and the cover member 16 described later to enterthe wavelength conversion member 12.

Furthermore, the first light guide member 13 preferably covers theentire lower face 12B of the wavelength conversion member 12. That is,the outer edges of the first light guide member 13 in a plan viewpreferably coincide with the outer edges of the lower face 12B of thewavelength conversion member 12. The first light guide member 13 maycover the lateral faces of the wavelength conversion member 12, butpreferably not cover.

The thickness of the first light guide member 13 covering the lateralfaces of the light emitting element 11 increases as it approaches thetop (i.e., becomes closer to the wavelength conversion member), anddecreases as it approaches the bottom (i.e., becomes more distant fromthe wavelength conversion member). The lateral faces 13 a of the firstlight guide member 13 which oppose the faces in contact with the lateralfaces of the light emitting element 11 may be planar faces surroundingthe periphery of the light emitting element 11, or may be curved facesinwardly concave or convex. The maximum thickness of the first lightguide member 13 covering the lateral faces of the light emitting element11 preferably matches the distance W2 which is from an outer edge of thelower face 12B of the wavelength conversion member 12 to an outer edgeof the upper face 11A of the light emitting element 11.

The first light guide member 13 is preferably formed with a lighttransmissive material which can guide the light emitted from the lightemitting element 11 to the wavelength conversion member 12.Specifically, the first light guide member 13 is preferably formed witha resin material because it can be easily handled and processed.Examples of the resin materials include resins containing one or more ofsilicone resins, modified silicone resins, epoxy resins, modified epoxyresins, acrylic resins, phenol resins, and fluorine resins, or theirhybrid resins. Among such examples, silicone resins is preferable due toits high heat resistant, electrically insulation, and flexibility. Thefirst light guide member 13 may contain a light diffusing materialsimilar to those discussed earlier. The first light guide member 13 maybe used as the adhesive for bonding the light emitting element 11 andthe wavelength conversion member 12. In this case, the first light guidemember 13 is also disposed between the upper face of the light emittingelement 11 and the lower face of the wavelength conversion member 12.

Light Transmissive Member 14

The light transmissive member 14 is disposed on the upper face 12A ofthe wavelength conversion member 12, and has a lower face 14B that has asmaller area than the upper face 12A of the wavelength conversion member12. The area of the lower face 14B of the light transmissive member 14,for example, is 90% at most of the upper face 12A of the wavelengthconversion member 12.

Moreover, the upper face 14A of the light transmissive member 14preferably has an area that is equal to, or smaller than, the upper face11A of the light emitting element 11. The area of the upper face 14A ofthe light transmissive member 14, for example, is equal to, or smallerthan, the upper face 11A of the light emitting element 11, preferably90% or smaller, more preferably 85% or smaller. Furthermore, it ispreferably an area of at least 50% of the upper face of the lightemitting element, more preferably at least 40% or 30%. Setting the upperface 14A of the light transmissive member 14 to an area smaller than theupper face 11A of the light emitting element 11 in this manner canreduce the emission area of the light emitting device 10, therebyproducing a higher luminance light emitting device.

The planar shape of the light transmissive member 14 can be a circular,ellipsoidal, or polygonal shape such as a square, rectangle, hexagon, orthe like. Among such shapes, forming it to substantially the same shapeas that of the upper face 12A of the wavelength conversion member 12 ispreferable from the standpoint of reduction in light emissionnon-uniformity. When the light emitting device is used in combinationwith an optical lens, moreover, the upper face shape of the lighttransmissive member 14 is preferably a circular or a polygonal shapethat is close to a circle.

The lower face 14B of the light transmissive member 14 is preferablypositioned inside the upper face 11A of the light emitting element 11and the upper face 12A of the wavelength conversion member 12. Forexample, in a plan view, some or all of the outer edges of the lowerface 14B are preferably disposed on the inside of the outer edges of theupper face 11A of the light emitting element 11, more preferably all ofthe outer edges are disposed on the inside thereof. Furthermore, some orall of the outer edges of the lower face 14B are preferably disposed onthe inside of the outer edges of the upper face 12A of the wavelengthconversion member 12, more preferably all of the outer edges aredisposed on the inner side thereof.

The light transmissive member 14 is preferably disposed so that theouter edges substantially coincide with the outer edges of the upperface 11A of the light emitting element 11 or on the inside thereof in aplan view. The lower face 14B of the light transmissive member 14 ispreferably disposed so that the center thereof substantially coincideswith the centers of the upper face 11A of the light emitting element 11and the upper face 12A of the wavelength conversion member 12. Similarto the light emitting element 11 the lower face 14B of the lighttransmissive member 14 can have various planar shapes, but preferablyhas a square, rectangular, or regular hexagonal shape, more preferablysubstantially the same shape as that of the upper face 11A of the lightemitting element 11.

In a sectional view, the distance W3 from an outer edge of the lowerface 14B of the light transmissive member 14 to an outer edge of theupper face 11A of the light emitting element 11 can be, for example,from 0 μm to 100 μm, preferably from 10 μm to 60 μm, more preferablyfrom 40 μm to 60 μm. This allows, when viewed from the light emissionface side, the lower face 14B of the light transmissive member 14 to beentirely positioned inside the light emitting element 11, therebyproducing a high light extraction efficiency light emitting device.Furthermore, the distance W1 from an outer edge of the lower face 14B ofthe light transmissive member 14 to an outer edge of the upper face 12Aof the wavelength conversion member 12 is preferably about 50 μm to 200μm.

The light transmissive member 14 can be formed with, for example, amolded resin body such as an epoxy, silicone, phenol, or polyimideresin, glass such as borosilicate, quartz, or sapphire, or a lighttransmissive material such as an inorganic material. Among suchexamples, a glass material is preferable for the light transmissivemember 14. The light transmissive member 14 constructs an outer surfaceof the light emitting device 10, therefore, the employment of a glassmaterial for the light transmissive member 14 can make the lightemission face less likely to degrade even in the case of a highluminance light emitting device with a reduced light emission face.Moreover, the surface of a glass material is not tacky as compared to aresin material. Accordingly, dust is less likely to adhere to the lightemission face, and the light emission face is less likely to stick to acarrier tape or the like during transportation or storage of the lightemitting device. The transmissivity here refers to the property ofallowing at least 60%, preferably at least 80%, of the light emittedfrom the light emitting element to pass through.

Moreover, the light transmissive member 14 preferably has a less thermalconductivity than the thermal conductivity of the materials thatconstruct the light emitting element. Specifically, the thermalconductivity of GaN is 1.3 W/cmk to 2.0 W/cmk, the thermal conductivityof GaP is 1.1 W/cmk, and the thermal conductivity of InP is 0.68 W/cmk,therefore, depending on the type of the light emitting element, thethermal conductivity of the light transmissive member is more preferablyless than these values. This facilitates with priority the dissipationof the heat generated by the wavelength conversion member via the lightemitting element to the substrate side.

The light transmissive member 14 may be formed with a single layer ofone type of material, a single layer of two or more materials combined,or multiple layers by stacking such single layers.

The light transmissive member 14 may contain any of the light diffusingmaterials described earlier as needed.

A single light emitting device may have one light transmissive member ormultiple light transmissive members. When a light emitting deviceincludes multiple light emitting elements and/or wavelength conversionmembers, as shown in FIG. 2, a single light transmissive member may beprovided for the multiple light emitting elements and/or wavelengthconversion members, or each light emitting element and/or wavelengthconversion member may be individually provided with a light transmissivemember.

When a single light transmissive member is provided for multiple lightemitting elements and/or wavelength conversion members, the area and thepositions of the outer edges described earlier and the distances, forexample W3 and W1, can be set to those that correspond to the areaenclosing the outer edges of the multiple light emitting elements and/orwave conversion members, the positions of the edges enclosing all outeredges of the light emitting elements and/or wavelength conversionmembers, and the distances corresponding thereto.

Second Light Guide Member 15

The second light guide member 15 is disposed to extend from the upperface 12A of the wavelength conversion member 12 to the lateral faces ofthe light transmissive member 14. The second light guide member 15covers at least parts of the lateral faces of the light transmissivemember 14, and may cover them entirely. That is, the uppermost edges ofthe second light guide member 15 may coincide with the uppermost edgesof the lateral faces of the light transmissive member 14. This allowsthe light emitted from the wavelength conversion member 12 to bereflected at the interfaces between the second light guide member 15 andthe cover member 16 described later to enter the wavelength conversionmember 12 or the light transmissive member 14. As a result, the emittedlight can be efficiently narrowed, and the luminance can be increased.

The second light guide member 15 covers at least part of the upper face12A of the wavelength conversion member 12, but preferably covers itentirely. That is, the outermost edges of the second light guide member15 preferably coincide with the outer edges of the upper face 12A of thewavelength conversion member 12. The second light guide member 15 maycover the lateral faces and/or the lower face of the wavelengthconversion member 12, but preferably not cover them. The second lightguide member 15, moreover, may cover the upper face of the lighttransmissive member, but preferably not cover it.

The thickness of the second light guide member 15 covering the lateralfaces of the light transmissive member 14 increases as it approaches thebottom (i.e., becomes closer to the wavelength conversion member 12) anddecreases as it approaches the top (i.e., becomes more distant from thewavelength conversion member 12). The lateral faces 15 a of the secondlight guide member 15 opposing the faces in contact with the lighttransmissive member 14 may be planar faces that enclose the outerperiphery of the light transmissive member 14 or curved faces outwardlyconcave or convex (i.e., to the cover member described later), but arepreferably outwardly concave faces. In this way, the thickness of thecover member 16 described later which is disposed on the upper face 12Aof the wavelength conversion member 12 can be increased. This can reducethe possibility of light leakage from the cover member surrounding theouter periphery of the upper face 14A of the light transmissive member14 on the light emission face side of the light emitting device 10,thereby producing a higher luminance light emitting device.

The second light guide member 15 is preferably formed with a lighttransmissive material that can guide the light emitted from thewavelength conversion member 12 to the light transmissive member 14. Forexample, it can be formed using the same or a similar material to thatused in forming the first light guide member 13.

The second light guide member 15 can be used as the adhesive to securethe wavelength conversion member 12 and the light transmissive member14. In this case, the second light guide member 15 is also disposedbetween the upper face of the wavelength conversion member 12 and thelower face of the light transmissive member 14.

It is preferable to use the same material for the first light guidemember 13 and the second light guide member 15. Using the same materialcan improve the operational efficiency during manufacturing. Moreover,it is preferable to adjust the viscosity of the second light guidemember 15 to be lower than the viscosity of the first light guide member13 when there is a large difference between the distance W1 from anouter edge of the lower face 14B of the light transmissive member 14 toan outer edge of the upper face 12A of the wavelength conversion member12 and the distance W2 from an outer edge of the lower face 12B of thewavelength conversion member 12 to an outer edge of the upper face 11Aof the light emitting element 11. This helps the second light guidemember 15 to spread over the upper face of the wavelength conversionmember 12 thereby covering the entire upper face of the wavelengthconversion member 12. The viscosity of the resin material can beadjusted, for example, by the amount of filler contained in the resinmaterial.

Cover Member 16

It is preferable for the light emitting device 10 in this embodiment tofurther include a cover member 16 that covers the lateral faces or thelike of the first light guide member 13 and the second light guidemember 15.

The cover member 16 covers the lateral faces of the light emittingelement 11, the lateral faces of the wavelength conversion member 12,the lateral faces 13 a of the first light guide member 13, the lateralfaces of the light transmissive member 14, and the lateral faces 15 a ofthe second light guide member 15. As shown in FIG. 1A, the cover member16 preferably also covers the lateral faces of the light emittingelement 11 exposed from the first light guide member 13, the lateralfaces of the light transmissive member 14 exposed from the second lightguide member 15, the upper face 12A of the wavelength conversion member12, the lower face of the light emitting element 11, and all electrodes.This allows essentially all light emitted from the light emittingelement 11 to enter the wavelength conversion member 12, and furtherenter the light transmissive member 14.

As described later, when the light emitting element 11 is mounted on thesubstrate 17, the cover member 16 is preferably further disposed betweenthe lower face of the light emitting element 11 and the substrate 17,and on the substrate 17.

The cover member 16 is preferably formed with a material that canreflect the light emitted from the light emitting element 11. It canspecifically be formed by using the same or a similar resin material tothat used for the first light guide member 13 with a light reflectingsubstance contained therein. Examples of light reflecting substancesinclude titanium oxide, silicon oxide, zirconium oxide, magnesium oxide,yttrium oxide, yttria-stabilized zirconia, calcium carbonate, calciumhydroxide, calcium silicate, zinc oxide, barium titanate, potassiumtitanate, alumina, aluminum nitride, boron nitride, mullite, and thelike. Among such examples, titanium oxide is preferable because it isrelatively stable against moisture and has a high refractive index.

The cover member 16 can be formed, for example, by injection molding,potting, printing, molding, compression molding, or the like.

Substrate 17

The light emitting element 11 may optionally be mounted on a substrate17. The substrate 17 can integrally support the light emitting element11 and the cover member 16. On the surface of the substrate 17, forexample, a wiring pattern is formed for electrical connection between anexternal power supply and the light emitting element. The light emittingelement is mounted on the wiring pattern, for example, via a bondingmember. The light emitting element 11 may be flip-chip mounted orface-up mounted on the substrate depending on the configuration thereof,but is preferably flip-chip mounted.

Examples of bonding members include bumps made of Au or alloys thereof,eutectic solder (Au—Sn), Pb—Sn, lead-free solder, and the like.

It is preferable to use for the substrate 17 an insulating materialbarely transmitting the light from the light emitting element 11 andexternal light. Examples include ceramic materials, such as alumina,aluminum nitride, or the like, and resin materials such as phenolresins, epoxy resins, polyimide resins, BT resin, polyphthalamide, orthe like. A composite component made of an insulating material and ametal member may alternatively be used. In the case of employing a resinmaterial for the substrate 17, inorganic fillers such as glass fibers,silicon oxide, titanium oxide, alumina, or the like may be mixed intothe resin as needed. This can enhance the mechanical strength, as wellas reducing the thermal expansion coefficient and increasing thereflectance. The substrate 17 can be set to a given thickness inaccordance with the purpose and applications.

On the substrate 17, a frame that surrounds the cover member 16 and/orthe cover member 16 or the like may be disposed, in addition to thelight emitting element 11.

Electronic Parts

The light emitting device 10 according to this embodiment may includeanother electronic part 18 placed adjacent to the light emitting element11, in addition to the light emitting element 11. Examples of electronicparts 18, which are parts provided for purposes other than lightemission of the light emitting device 10, include a transistor forcontrolling the light emitting element, a protection element, such as aZener diode to which an electric current flows when a prescribed levelof voltage or higher is applied, and the like. These electronic parts 18are preferably embedded in the cover member 16.

In the light emitting device 10 constructed as above, the light emittedfrom the light emitting element passes through the wavelength conversionmember 12 having a larger area before externally output from the upperface 14A of the light transmissive member 14, the light emission face ofthe light emitting device 10, while the emission area becomes smaller bymeans of the second light guide member 15 and the light transmissivemember 14.

That is, by separating the wavelength conversion portion from theportion reducing an light emission area, the distance of travel isshortened for the light that passes through the wavelength conversionmember 12 to thereby minimize the scattering effect of the wavelengthconversion substances. This can increase the light extractionefficiency, producing a higher luminance light emitting device 10.

Method of Manufacturing Light Emitting Device

The light emitting device described above can be manufactured, forexample, by the methods explained below.

Manufacturing Method A

A wavelength conversion member having a lower face that has a largerarea than the upper face of the light emitting element is bonded on theupper face of a light emitting element via an uncured resin materialused for forming a first light guide member, while disposing the firstlight guide member to extend from the lateral faces of the lightemitting element to the lower face of the wavelength conversion member.

A light transmissive member having a lower face that has a smaller areathan the upper face of the wavelength conversion member is bonded on theupper face of the wavelength conversion member which is bonded to thelight emitting element, via an uncured resin material used for forming asecond light guide member, while disposing the second light guide memberto extend from the upper face of the wavelength conversion member to thelateral faces of the light transmissive member.

Manufacturing Method B

A wavelength conversion member having a lower face that has a largerarea than the upper face of the light emitting element is directlybonded on the upper face of a light emitting element.

A first light guide member is disposed to extend from the lateral facesof the light emitting element to the lower face of the wavelengthconversion member.

A light transmissive member having a lower face that has a smaller areathan the upper face of the wavelength conversion member is bonded on theupper face of the wavelength conversion member which is bonded to thelight emitting element via an uncured resin material used for forming asecond light guide member, while disposing the second light guide memberto extend from the upper face of the wavelength conversion member to thelateral faces of the light transmissive member.

Manufacturing Method

A wavelength conversion member having a lower face that has a largerarea than the upper face of the light emitting element is prepared.

A light transmissive member having a lower face that has a smaller areathan the upper face of the wavelength conversion member is directlybonded on the upper face of the wavelength conversion member.

A second light guide member is disposed to extend from the upper face ofthe wavelength conversion member to the lateral faces of the lighttransmissive member.

The wavelength conversion member whose upper face is bonded to the lighttransmissive member is bonded on the upper face of the light emittingelement, via an uncured resin material used for forming a first lightguide member, while disposing the first light guide member to extendfrom the lateral faces of the light emitting element to the lower faceof the wavelength conversion member.

Manufacturing Method D

A wavelength conversion member having a lower face that has a largerarea than the upper face of the light emitting element is directlybonded on the upper face of a light emitting element.

A light transmissive member having a lower face that has a smaller areathan the upper face of the wavelength conversion member is directlybonded on the upper face of the wavelength conversion member.

A first light guide member is disposed to extend from the lateral facesof the light emitting element to the lower face of the wavelengthconversion member.

A second light guide member is disposed to extend from the upper face ofthe wavelength conversion member to the lateral faces of the lighttransmissive member.

In any of the manufacturing methods described above, it is preferable toperform, at any given stage, disposing a light emitting element 11 on asubstrate 17, and perform disposing a cover member at any given stageafter disposing a first light guide member 13 and a second light guidemember 15.

Each step in the manufacturing methods described above can be performedby the methods described below.

Bonding Light Emitting Element 11 or Light Transmissive Member 14 toWavelength Conversion Member 12

Methods of bonding the light emitting element 11 and/or the lighttransmissive member 14 to the wavelength conversion member 12 includethose that are known in the art.

For example, pressure bonding, sintering, or room temperature bondingmay be used. Among these examples, room temperature bonding ispreferable.

As room temperature bonding, for example, surface activated bonding,hydroxyl group bonding, or atomic diffusion bonding can be utilized.Surface activated bonding is a method in which surfaces to be bonded areprocessed in a vacuum to facilitate chemical bonding before being bondedtogether. Hydroxyl group bonding is a method in which hydroxyl groupsare formed on the surfaces to be bonded by way of, for example, atomiclayer deposition, followed by allowing the hydroxyl groups on thesurfaces to be bonded with one another. Atomic diffusion bonding is amethod in which a metal film having a monoatomic layer thickness isformed on each of the surfaces to be bonded, followed by being broughtinto contact with one another in a vacuum or inert gas atmosphere toachieve metal atom bonding. Using such a direct bonding method allowsthe light emitting element 1 and the wavelength conversion member 12 tobe integrated under temperatures close to room temperature.

Disposing First Light Guide Member 13 and Second Light Guide Member 15

The first light guide member 13 and the second light guide member 15 canbe formed, for example, by potting, printing, or the like. Among theseexamples, potting is preferably employed using the uncured resinmaterials described earlier. The first light guide member 13 and thesecond light guide member 15 are preferably formed to have a concavesurface. Such a surface shape can easily be achieved by potting. Byadjusting the amount and/or viscosity of the uncured resin materialused, the surface can be suitably controlled to have a concave or convexshape. The resin materials may contain a filler for adjusting theviscosity. Using a resin material for the first light guide member 13and the second light guide member 15 allows the first light guide member13 or the second light guide member 15 to creep on and partially orentirely cover the lateral faces of the light emitting element or thelight transmissive member.

Mounting on Substrate 17

The light emitting element 11 is preferably mounted on a substrate 17.Flip-chip mounting is a preferable method used to mount the lightemitting element 11. The wavelength conversion member or the like can bedisposed on the light emitting element 11 before or after mounting thelight emitting element on the substrate.

Disposing Cover Member 16

A cover member 16 is disposed to cover the lateral faces of thewavelength conversion member 12, lateral faces of the first light guidemember 13, and lateral faces of the second light guide member 15.Specifically, the cover member 16 is formed by disposing an uncuredresin material 16A for forming the cover member 16 in the surrounds ofthe light emitting element 11, and optionally on the substrate 17.

The uncured resin member 16A employed for forming the cover member 16can be applied by using, for example, a resin dispenser that can bemoved up and down or from side to side relative to the substrate 17. Thecover member 16 can alternatively be formed by using, for example,molds.

Embodiment 1

Light Emitting Device

As shown in FIG. 1A, a light emitting device 10 according to Embodiment1 includes a light emitting element 11, a wavelength conversion member12, a first light guide member 13, a light transmissive member 14, and asecond light guide member 15. The light emitting element 11 is mountedon a substrate 17 having a wiring layer, and a cover member 16 isdisposed surrounding the light emitting element 11, between the lightemitting element 11 and the substrate 17, and on the substrate 17.

The light emitting element 11 is an LED chip having substantially asquare shape of 0.8×0.8 mm in a plane view, and 0.15 mm in height, whichincludes a pair of positive and negative electrodes on the same faceside.

The substrate 17 is formed using aluminum nitride, and has a wiringlayer at least on the upper face. On the wiring layer, the lightemitting element 11 is flip-chip mounted via gold bumps.

On the light emitting element 11, a YAG ceramic having substantially asquare shape of 0.9×0.9 mm in a plan view, and 1.10 μm in height isdisposed as the wavelength conversion member 12 so that the centerthereof substantially coincides with the center of the light emittingelement 11 in a plan view. The YAG ceramic here is made by sinteringalumina containing a YAG-based phosphor, and bonded on the lightemitting element 11 via the first light guide member.

The first light guide member 13 is disposed to extend from the lateralfaces of the light emitting element 11 to the lower faces of thewavelength conversion member 12. That is, the first light guide member13 is disposed to be in contact with at least a portion of the lowerface of the wavelength conversion member. The first light guide member13 has the upper end in contact with the lower face of the wavelengthconversion member 12, and the lower end in contact with the lateralfaces of the light emitting element 11. The edges of the first lightguide member 13 on the outer side substantially coincide with the outeredges of the lower face of the wavelength conversion member 12. Thethickness of the first light guide member 13 becomes smaller as itapproaches the substrate 17 along the lateral faces of the lightemitting element 11. The lateral faces of the first light guide member13 opposing the lateral faces of the light emitting element 11 areoutwardly concave faces. The first light guide member 13 is a siliconeresin which contains a filler for adjusting the viscosity. The firstlight guide member 13 is concurrently used as a bonding member betweenthe light emitting element 11 and the wavelength conversion member 12being interposed between the light emitting element 11 and thewavelength conversion member 12.

On the upper face 12A of the wavelength conversion member 12,transparent glass having substantially a square shape of 0.76×0.76 mm ina plan view, and 100 μm in height is disposed so that the center thereofsubstantially coincides with the centers of the light emitting element11 and the wavelength conversion member 12 in a plan view. Thetransparent glass here is borosilicate glass which is bonded on thelight emitting element 11 via the second light guide member.

The second light guide member 15 is disposed to extend from the upperface of the wavelength conversion member 12 to the lateral faces of thelight transmissive member 14. The second light guide member 15 has thelower end in contact with the upper face of the wavelength conversionmember 12, and the upper end in contact with the lateral faces of thelight transmissive member 14. Furthermore, on the upper face of thewavelength conversion member 12, the outer edges of the second lightguide member 15 coincide with the outer edges of the wavelengthconversion member 12. The thickness of the second light guide member 15becomes smaller as it approaches the upper face 14A along the lateralfaces of the light transmissive member 14. The lateral faces of thesecond light guide member 15 opposing the lateral faces of the lighttransmissive member 14 are outwardly concave faces. The second lightguide member 15 is a silicone resin which contains silica as a fillerfor adjusting the viscosity. The second light guide member 15 isconcurrently used as a bonding member between the wavelength conversionmember 12 and the light transmissive member 14 being interposed betweenthe wavelength conversion member 12 and the light transmissive member14.

The light emitting element 11 is disposed so that its outer edges arepositioned inner side of the outer edges of the wavelength conversionmember in a plan view.

The upper face area of the light transmissive member 14 is smaller thanthe upper face areas of the light emitting element 11 and the wavelengthconversion member 12, and the outer edges are located on inner side ofthe outer edges of the light emitting element and the wavelengthconversion member in a plan view.

The thickness of the wavelength conversion member is smaller than thethickness of the light transmissive member.

Moreover, the thermal conductivity of the borosilicate glass employed asthe light transmissive member is less than the thermal conductivity ofsapphire which is a material used in constructing the light emittingelement.

Such a light emitting device 10 can be produced, for example, by themanufacturing Method A described earlier.

For comparison purposes, light emitting devices R, X, Y, and Z eachhaving a similar construction to the light emitting device 10 except asshown in FIGS. 3B-3E were produced. For the bonding members between thelight emitting element and the wavelength conversion member, and betweenthe wavelength conversion member and the light transmissive member, afirst light guide member and a second light guide member, respectively,were used. For this reason, the first light guide member and the secondlight guide member are interposed between the light emitting element andthe wavelength conversion member, and between the wavelength conversionmember and the light transmissive member, respectively. For this reason,with respect to the light emitting devices R (FIG. 3B) and X (FIG. 3C),some wetting and spreading of the second light guide member onto thelateral faces of the light transmissive member is expected.

The same types of phosphors were used for the wavelength conversionsubstances contained in the wavelength conversion members of the lightemitting devices 10 (FIG. 3A), R (FIG. 3B), X (FIG. 3C), Y (FIG. 3D),and Z (FIG. 3E), and the phosphor contents were adjusted so that theselight emitting devices achieve comparable chromaticity.

To each of the light emitting device 10 explained earlier and the lightemitting devices R, X, Y, and Z produced for comparison purposes, anelectric current of 1000 mA was applied to measure the luminous flux.The results shown below confirmed that the light emitting device 10achieved a higher luminous flux than any of the light emitting devicesR, X, Y, and Z. The notation. “(minimal)”, in the second light guidemember 15 column for the light emitting devices R and X means thatalthough an adhesive is interposed between the wavelength conversionmember and the light transmissive member, most of the upper face of thewavelength conversion member that is positioned on the outside of theouter edges of the light transmissive member (specifically 90% or more)is exposed from the adhesive.

TABLE 1 First Second Light Light Relative Light Wavelength Guide LightGuide Value of Emitting Conversion Member Transmissive Member LuminousLuminous Device Member 12 13 Member 14 15 Flux (lm) Flux (%) 10 (FIG.3A) 0.9 × 0.9 mm Present 0.76 × 0.76 mm Present 126.6 112.3 110 μm 100μm thick thick R (FIG. 3B) 0.9 × 0.9 mm Present 0.76 × 0.76 mm Absent124.7 110.6 110 μm 100 μm thick (minimal) thick X (FIG. 3C) 0.9 × 0.9 mmPresent Wavelength Absent 115.3 102.3 110 μm conversion (minimal) thickmember: 0.76 × 0.76 mm 70 μm thick Y (FIG. 3D) 0.76 × 0.76 mm PresentAbsent Absent 112.7 100 180 μm thick Z (FIG. 3E) 0.76 × 0.76 mm PresentAbsent Absent 125.2 110.9 110 μm thick

As described above, in the light emitting device 10, the light emittedfrom the light emitting element 11 enters the wavelength conversionmember 12 while the planar area is increased by means of the first lightguide member 13, therefore, the luminous flux per unit area of the lightentering the lower face 12B of the wavelength conversion member 12 isreduced. This can reduce the wavelength conversion substance content perunit area in the direction of the thickness of the wavelength conversionmember 12 thereby enabling the reduction in the thickness of thewavelength conversion member 12 itself. That is, the distance of travelof the light passing through the wavelength conversion member 12 isshort, therefore excessive scattering in the wavelength conversionmember 12 can be attenuated. This can improve the light extractionefficiency. Furthermore, the light of a given emission color achieved bypassing through the wavelength conversion member 12 is externally outputfrom the upper face 14A of the light transmissive member 14 which has asmaller planar area by means of the second light guide member 15 and thelight transmissive member 14. Here, wavelength conversion substances issubstantially absent in the second light guide member 15 and the lighttransmissive member 14 involved in the gradual reduction in the emissionarea, thereby reducing light attributable to scattering or the likecaused by wavelength conversion substances or the like before the lightreaches the upper face 14A of the light transmissive member 14. This canproduce a light emitting device having a higher light extractionefficiency.

Embodiment 2

Light Emitting Device

As shown in FIG. 2, the light emitting device 20 according to embodiment2 includes two light emitting elements 21, a wavelength conversionmember 22 covering both of the light emitting elements, a first lightguide member 23 disposed on the lateral faces of each light emittingelement 21, a light transmissive member 24 disposed on the wavelengthconversion member 22, and a second light guide member 25 disposed on thelateral faces of the light transmissive member 24. The two lightemitting elements 21 are arranged on the substrate 27 having a wiringlayer so that they form a rectangle as a whole in a plan view. The lightemitting device 20 according to Embodiment 2 essentially has a similarconstruction to that of the light emitting device 10 except forincluding multiple light emitting elements 21 and disposing the firstlight guide member 23 and the cover member 26 between the adjacent lightemitting elements 21.

The light emitting device 20 having multiple light emitting elements asdescribed above has the same or similar effects to those of the lightemitting device 10.

By including multiple light emitting elements 21, in particular, an evenhigher luminance light emitting device can be produced. Furthermore, byvirtue of the first light guide member 23 covering the lateral faces ofthe adjacent light emitting elements facing each other, non-uniformityof color and luminance between the adjacent light emitting elements canbe attenuated. At this time, the first light guide member 23 preferablyhas lateral faces that are concave to the substrate. Such a shape makesthe exterior face of the first light guide member 23 an appropriatereflective surface to reflect the light from the lateral faces of thelight emitting elements to efficiently guide the reflected light to thewavelength conversion member 22.

In a plan view, the outermost edges of the first light guide member 23surrounding the light emitting elements 21 are located inner side of theouter edges of the wavelength conversion member 22.

The upper face 24A and the lower face 24B of the light transmissivemember 24 have smaller areas than the area of the upper face 22A of thewavelength conversion member 22, and the outer edges of the lighttransmissive member 24, in a plan view, are positioned inner side of theouter edges of the upper face 22A of the wavelength conversion member 22that surround the upper faces 21A of the two light emitting elements 21.

The thickness of the wavelength conversion member 22 is larger than thethickness of the light transmissive member 24.

What is claimed is:
 1. A method of manufacturing a light emitting devicecomprising: bonding a wavelength conversion member on an upper face of alight emitting element while disposing a first light guide member toextend from a lateral face of the light emitting element to a lower faceof the wavelength conversion member, the lower face of the wavelengthconversion member having a larger area than the upper face of the lightemitting element; and bonding a light transmissive member on an upperface of the wavelength conversion member while disposing a second lightguide member to extend from the upper face of the wavelength conversionmember to a lateral face of the light transmissive member, a lower faceof the light transmissive member having a smaller area than the upperface of the wavelength conversion member.
 2. The method of manufacturinga light emitting device according to claim 1, wherein the bonding of thewavelength conversion member on the upper face of the light emittingelement includes using an uncured resin material used for forming thefirst light guide member.
 3. The method of manufacturing a lightemitting device according to claim 1, wherein the bonding of the lighttransmissive member on the upper face of the wavelength conversionmember includes using an uncured resin material used for forming thesecond light guide member.
 4. The method of manufacturing a lightemitting device according to claim 2, wherein the bonding of the lighttransmissive member on the upper face of the wavelength conversionmember includes using an uncured resin material used for forming thesecond light guide member.
 5. The method of manufacturing a lightemitting device according to claim 1, wherein an upper face of the lighttransmissive member has a smaller area than the upper face of the lightemitting element.
 6. The method of manufacturing a light emitting deviceaccording to claim 1, wherein the bonding of the light transmissivemember on the upper face of the wavelength conversion member includesbonding the light transmissive member on the upper face of thewavelength conversion member so that an outer edge of the lighttransmissive member is positioned on an inner side of an outer edge ofthe light emitting element in a plan view.
 7. The method ofmanufacturing a light emitting device according to claim 1, wherein thebonding of the wavelength conversion member on the upper face of thelight emitting element includes bonding the wavelength conversion memberon the upper face of the light emitting element so that an outer edge ofthe light emitting element is positioned on an inner side of an outeredge of the wavelength conversion member in a plan view.
 8. The methodof manufacturing a light emitting device according to claim 1, furthercomprising covering lateral surfaces of the first light guide member,the wavelength conversion member and the second light guide member witha cover member.
 9. The method of manufacturing a light emitting deviceaccording to claim 1, wherein the bonding of the wavelength conversionmember on the upper face of the light emitting element includes bondingthe wavelength conversion member on an upper face of one or moreadditional light emitting elements.
 10. The method of manufacturing alight emitting device according to claim 1, further comprising mountingthe light emitting element on a substrate in a flip-chip manner.
 11. Themethod of manufacturing a light emitting device according to claim 1,wherein the bonding of the wavelength conversion member on the upperface of the light emitting element includes bonding the wavelengthconversion member on the upper face of the light emitting element sothat the upper face of the light emitting element is in contact with thelower face of the wavelength conversion member.
 12. The method ofmanufacturing a light emitting device according to claim 1, wherein thebonding of the wavelength conversion member on the upper face of thelight emitting element includes bonding the wavelength conversion memberon the upper face of the light emitting element so that the upper faceof the light emitting element is bonded to the lower face of thewavelength conversion member via an adhesive.
 13. The method ofmanufacturing a light emitting device according to claim 1, wherein thebonding of the light transmissive member on the upper face of thewavelength conversion member includes bonding the light transmissivemember on the upper face of the wavelength conversion member so that theupper face of the wavelength conversion member is in contact with thelower face of the light transmissive member.
 14. The method ofmanufacturing a light emitting device according to claim 1, wherein thebonding of the light transmissive member on the upper face of thewavelength conversion member includes bonding the light transmissivemember on the upper face of the wavelength conversion member so that theupper face of the wavelength conversion member is bonded to the lowerface of the light transmissive member via an adhesive.
 15. The method ofmanufacturing a light emitting device according to claim 1, wherein athickness of the wavelength conversion member is smaller than athickness of the light transmissive member.
 16. The method ofmanufacturing a light emitting device according to claim 8, wherein thecover member contains a light reflecting substance.